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?Placement Speed : 11,000 CPH (Optimum)

?The Number of Spindles : 1 Gantry x 3 Spindle

?Component Range : 0402~□ 55mm/ ~L74 mm x W55mm (H15mm)

?Placement Accuracy : ±40 μm @ Cpk ≥ 1.0/Chip

                 ±30 μm @ Cpk ≥ 1.0/Lead,BGA

?PCB Size : ~L510 x W580, Single lane

                ~L750 x W580(Max Option)

                ~L510 x W310, Dual lane

                ~L750 x W310(Max Option)

?靈活的PCB處理能力

?使用Outbuffer

?使用PBI(Post Bonding Inspection)功能檢查元器件的貼裝不良

?Height Sensor

?Backlight識別

?NPE(New Part editor)

?Panorama View

?提高了外圍設(shè)備的使用便利性